Cefdinir is a broad spectrum third generation cephalosporin antibiotic resistant to many β-lactamase enzymes.  Cefdinir is highly soluble in aqueous solution (87.2 mg/mL).

Kaul et al. used cefdinir from TOKU-E to study synergistic effects of cefdinir and the prodrug, TXA709 against Methicillin-Resistant Staphylococcus aureus (MRSA)."Combining the FtsZ-Targeting Prodrug TXA709 and the Cephalosporin cefdinir confers synergy and reduces the frequency of resistance in Methicillin-resistant Staphylococcus aureus." 

CAS Number

91832-40-5

Molecular Formula

C₁₄H₁₃N₅O₅S₂

Molecular Weight

395.42

Mechanism of Action

Cephalosporins interfere with PBP (penicillin binding protein) activity involved in the final phase of peptidoglycan synthesis. PBP’s are enzymes which catalyze a pentaglycine crosslink between alanine and lysine residues providing additional strength to the cell wall. Without a pentaglycine crosslink, the integrity of the cell wall is severely compromised and ultimately leads to cell lysis and death. Resistance to cephalosporins is commonly due to cells containing plasmid encoded β-lactamases, however, cefdinir is not typically inactivated by this mechanism.

Storage Conditions

-20°C

Tariff Code

2941.90.5000

Spectrum

Cefdinir is a broad spectrum antibiotic targeting both gram positive and gram negative pathogens responsible for ear, sinus and skin infections.

Specifications:

用于敏感性测试的TOKU-E优化抗菌剂抗菌素在生命科学研究中有许多应用，但并非总是针对您的独特应用进行优化。药物级抗生素是为体内系统设计的，但并未针对体外系统进行优化。甚至USP和EP级材料也没有针对AST平台进行优化。TOKU-E服务旨在使用优化的抗菌剂来完善AST测试平台，从而改善工作流程，提高效率并提高有效性。有多种方法可以优化磁化率测试平台，以提高效率和性能，并且TOKU-E可以在以下方面提供帮助：溶解度：许多AST系统都要求抗生素可溶于水或其他兼容溶剂。如果您的系统对最佳性能有特定要求，我们可以增强其对平台的溶解度。稳定性：抗生素的降解受杂质，浓度和储存条件的影响。TOKU-E可以针对预期的平台进行稳定性研究（实时/加速），并通过加入稳定剂/赋形剂，改性化合物或改善杂质分布来延长产品寿命，从而提高制剂的稳定性。效能/杂质分析：药物级抗菌剂包含可能会影响其性能的杂质。控制杂质分布可以避免错误的正/负结果。我们可以纯化抗生素以去除杂质，从而提高性能。TOKU-E能够以极低的浓度测量抗生素活性，从而可以更准确地确定抗生素的浓度。微生物敏感性测试功能支持系统的验证和性能验证。灌装/干燥：灌装/分配和干燥程序（空气/真空/冻干），用于工艺优化工作流程。配方：制备具有最佳稀释剂，赋形剂/添加剂，抗微生物混合物配方，改变粒径的抗微生物溶液，是我们可以制备定制产品以满足您需求的方法。塑料：具有工业合作伙伴的定制塑料制造能力，包括塑料注塑成型，泡罩包装设计和板/面板制造能力。